Technology Category
- Sensors - Infrared Sensors
- Sensors - Thermal Conductivity Sensors
Applicable Industries
- Electrical Grids
- Electronics
Applicable Functions
- Product Research & Development
Use Cases
- Intelligent Packaging
- Virtual Prototyping & Product Testing
About The Customer
Samsung Electronics Inc. is a global leader in technology, specializing in the production of a wide range of consumer and industry electronics, including appliances, digital media devices, semiconductors, memory chips, and integrated systems. The company's IPT group is specifically responsible for the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group also handles the analysis of various package designs and is tasked with the development of new package designs.
The Challenge
Samsung Electronics Inc.’s IPT group specializes in the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group is responsible for the analysis of leadframe, ball grid array (BGA), and tape automated bonding (TAB) packages, as well as the development of new package designs. However, as the demand for more complex modules of system-in-package (SIP) and package-on-package (POP) design increases, the need for more accurate and easier-to-use simulation solutions becomes apparent. The challenges faced by the IPT group include detailed modeling, type diversity, maintaining device integrity and its electrical performance, and making thermal software accessible to non-thermal engineers.
The Solution
Samsung Electronics adopted ANSYS software to address these challenges. ANSYS software can handle various types and kinds of packages by importing the ECAD design file as a prototype. It has a built-in solver that adapts to any new package supporting on-chip distributed power and thermally induced power generation. This leads to a thermally optimal distribution and provides a one-step process from modeling to solving and reporting, making it easier for non-thermal engineers to perform simulations. The software's ability to directly import ECAD drawing files for prototype-intuitive modeling, its fast and accurate solution speed, and its application to various types of packages significantly increased thermal analysis efficiency.
Operational Impact
Quantitative Benefit
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