Terepac
Giving Voice to the World
Overview
HQ Location
Canada
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Year Founded
2004
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Company Type
Private
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Revenue
< $10m
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Employees
11 - 50
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Website
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Company Description
Terepac was founded in 2004 to commercialize breakthrough innovations which overcome these limitations through an entirely new paradigm for assembly, integration and packaging of electronic products.
The company’s revolutionary technologies enable sophisticated microelectronics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance.
The company’s revolutionary technologies enable sophisticated microelectronics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance.
IoT Snapshot
Terepac is a provider of Industrial IoT platform as a service (paas), and application infrastructure and middleware technologies.
Technology Stack
Terepac’s Technology Stack maps Terepac’s participation in the platform as a service (paas), and application infrastructure and middleware IoT Technology stack.
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Devices Layer
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Edge Layer
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Cloud Layer
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Application Layer
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Supporting Technologies
Technological Capability:
None
Minor
Moderate
Strong
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