Comsol > 实例探究 > Capacitively Coupled Plasma Analysis

Capacitively Coupled Plasma Analysis

Comsol  Logo
公司规模
SME
地区
  • America
国家
  • United States
产品
  • COMSOL Multiphysics
技术栈
  • Multiphysics Simulations
  • Two-term Boltzmann Approximation
实施规模
  • Pilot projects
影响指标
  • Innovation Output
  • Productivity Improvements
技术
  • 分析与建模 - 数字孪生/模拟
  • 分析与建模 - 预测分析
适用行业
  • 半导体
  • 电子产品
适用功能
  • 产品研发
用例
  • 过程控制与优化
  • 数字孪生
服务
  • 软件设计与工程服务
  • 系统集成
关于客户
AltaSim Technologies, based in Columbus, Ohio, specializes in advanced simulation technologies. The company focuses on providing high-fidelity simulations for complex physical phenomena, including plasma processes. AltaSim Technologies employs a team of experts in various fields of engineering and physics to deliver cutting-edge solutions for their clients. Their expertise in multiphysics simulations allows them to tackle challenging problems in industries such as semiconductors and electronics. By leveraging tools like COMSOL Multiphysics, AltaSim Technologies aims to enhance the development and optimization of advanced manufacturing processes.
挑战
The multiphysics nature of plasmas presents enormous challenges for numerical simulations; analysis of the CCP process presents added difficulty due to the existence of a plasma sheath, the dynamic behavior of the plasma, and the large number of RF cycles required to reach a periodic steady state. Power deposition into the plasma is highly non-linear and the strong gradient of the electric field in the plasma sheath may lead to numerical instabilities unless a sufficiently fine mesh is applied. Typical CCP reactors may also contain sharp geometric corners that can cause a substantial local electric field that provide unphysical ion fluxes.
解决方案
AltaSim Technologies has performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors for Maxwellian and non-Maxwellian cases using COMSOL Multiphysics. Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation as a preprocessing step to the numerical analysis of the plasma. Ion densities are shown in Figure 1 for a 1D simulation of a non-Maxwellian plasma. Extensions of the model to analyze the plasma behavior for a Maxwellian plasma in a 2D case are shown in Figures 2 and 3. The simulations incorporate the multiphysics nature of plasmas and consequently can be used to assist with the development of new CCP processing technology.
运营影响
  • AltaSim Technologies successfully performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors.
  • The simulations incorporated the multiphysics nature of plasmas, addressing the challenges posed by plasma sheaths and dynamic behavior.
  • Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation, enhancing the accuracy of the simulations.
  • The results provided insights into ion densities for both Maxwellian and non-Maxwellian plasmas, aiding in the development of new CCP processing technology.
  • The use of COMSOL Multiphysics allowed for detailed analysis and optimization of plasma behavior in CCP reactors.

Case Study missing?

Start adding your own!

Register with your work email and create a new case study profile for your business.

Add New Record

相关案例.

联系我们

欢迎与我们交流!
* Required
* Required
* Required
* Invalid email address
提交此表单,即表示您同意 IoT ONE 可以与您联系并分享洞察和营销信息。
不,谢谢,我不想收到来自 IoT ONE 的任何营销电子邮件。
提交

感谢您的信息!
我们会很快与你取得联系。